Английский Технологии
06.07.2026 Читать источник
Компания Stackpole расширила серию высокоточных токовых резисторов CSSU новыми значениями сопротивления
Производитель Stackpole Electronics добавил в линейку CSSU резисторы с сопротивлением 0,5 мОм и 20 мОм, сохранив мощность рассеивания 5 Вт в стандартном корпусе 2512. Новое решение позволяет инженерам повышать плотность мощности на печатных платах и оптимизировать схемы для систем управления батареями и автомобильной электроники.
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06-07-2026 | Stackpole | Passives
Stackpole Electronics has expanded its CSSU Series of High-Power Metal Alloy Current Sense Resistors by adding 0.5mΩ and 20mΩ resistance values, extending the series' design flexibility while maintaining a 5W power rating in a 2512 package. The new 0.5mΩ resistor enables lower power dissipation and reduced measurement losses in high-current circuits, making it well-suited for next-generation power conversion and battery-powered systems. The addition of the 20mΩ value broadens the usable resistance range for applications requiring higher current sensing voltages or lower operating currents.
The series is built for demanding power electronics environments, combining low resistance, low TCR, excellent long-term stability, and AEC-Q200 qualification. Its ability to dissipate up to 5W in a standard 2512 footprint helps designers increase power density while reducing the need for larger current-sensing components or additional board area.
Typical applications include battery management systems, automotive electronics, motor drives, industrial power supplies, DC-DC converters, renewable energy equipment, and other high-current power control systems.
For more information about the CSSU Series high-power metal alloy current sense resistor, visit www.seielect.com/catalog/SEI-CSSU.pdf
Standard 2512 surface-mount device (SMD) thick-film resistors are typically limited to power dissipation levels of 1W to 2W due to poor thermal conduction. The CSSU Series bypasses this constraint through a robust all-metal alloy element technology co-designed with integrated structural heat sinks. This design minimises the localised internal hot-spot temperature coefficient and rapidly channels thermal energy out through the PCB solder pads. This allows the device to sustain a continuous 5W power rating in an industry-standard 2512 package footprint (6.35mm x 3.05mm).
The expansion of the CSSU value matrix targets two opposing, critical problem sets in power distribution network (PDN) monitoring:
Engineered to operate reliably in highly volatile and punishing industrial or automotive environments, the CSSU series features strict material limits:
When designing a high-capacity circuit, engineers traditionally had to use larger 3W or 5W footprint varieties (like 2816 or 4527 packages) or parallel multiple smaller resistors to distribute heat safely. The CSSU series packs a full 5W capability directly into the standard 2512 footprint. This spatial compression increases board-level power density by up to 40% to 60%, drastically shrinking the physical footprint required by the current-sensing block.
The combination of an all-metal alloy element, low thermal EMF, and high power handling makes the CSSU portfolio highly effective across several high-current power control systems:
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