Корнинг разрабатывает стеклянные подложки для решения проблем передового упаковки чипов

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as 2.5D integration, 3D ICs, chiplets, and heterogeneous integration allow the semiconductor industry to continue improving system-level performance by bringing more functions, memory, and interconnects closer together inside increasingly sophisticated package architectures. The rise of artificial intelligence is accelerating this shift. AI accelerators, high-bandwidth memory, and large-scale computing systems require higher bandwidth, lower latency, better power efficiency, and greater integration density. As a result, advanced packaging is no longer simply a back-end process consideration. It is becoming a central technology platform for enabling next-generation computing performance. This transition is also changing the role of materials. In advanced packaging, materials do more than provide mechanical support. They influence manufacturability, warpage control, dimensional stability, interconnect density, electrical performance, yield, and long-term reliability. As package architectures become larger and more complex, glass is drawing greater attention as a potential materials platform for demanding semiconductor packaging environments. Corning is among the materials suppliers addressing these requirements, drawing on its experience in glass formulation, dimensional control, and high-volume manufacturing to develop glass-based solutions for advanced packaging. Materials Move to the Center of Advanced Packaging As advanced packaging becomes more central to semiconductor evolution, its technical challenges also become more difficult to manage. Larger package sizes increase the risk of warpage and mechanical distortion. Higher interconnect density requires finer patterning and more stable electrical behavior. The integration of chiplets, HBM stacks, interposers, and heterogeneous components creates more complex physical architectures, where differences in materials, thermal behavior, and mechanical stress must be carefully controlled. At the same time, manufacturers must maintain tighter tolerances and higher yields across increasingly demanding process flows. These pressures are making materials a more decisive factor in advanced packaging. Next-generation packages must not only connect more components in a smaller, denser space; they must also maintain electrical performance, structural stability, thermal reliability, and dimensional precision throughout manufacturing and operation. As AI packages continue to scale in complexity and functionality, the materials used in carriers, substrates, and other packaging structures can directly influence what can be manufactured efficiently and what can perform reliably at scale. In this environment, conventional materials may face limitations. Maintaining both dimensional stability and interconnect density becomes more difficult as package sizes grow. If a material cannot preserve flatness, surface quality, and mechanical stability across increasingly demanding process flows, it can affect bonding, patterning, alignment, and ultimately yield. That is why glass is gaining relevance in semiconductor applications. Glass offers potential advantages in flatness, dimensional stability, surface quality, and precision processing. These attributes are especially important as advanced packaging moves toward larger form factors, thinner wafers, and higher-density integration. Glass Carriers Support Manufacturability One of the most immediate applications of glass in semiconductor manufacturing is as a carrier substrate supporting thin-wafer processing for HBM, 3D stacking, and other advanced packaging technologies. As wafers become thinner to support HBM and 3D stacking, manufacturers face growing challenges in warpage control, wafer handling, and yield. Thin wafers can be fragile and difficult to process without temporary support, especially during thinning, bonding, redistribution, and fan-out processing. Glass carriers can help address these challenges by providing a stable, highly flat supporting platform. In advanced packaging, a carrier must hold the wafer securely, maintain dimensional stability through demanding process conditions, and also support precise handling and release without introducing additional process risk. Glass offers potential advantages in flatness, dimensional stability, surface quality, and precision processing. Corning's advanced packaging carriers are designed for temporary bonding in advanced semiconductor packaging processes, including silicon wafer thinning, fan-out packaging, and advanced 2.5D/3D packaging. The company's carrier portfolio includes both standard glass carriers and advanced packaging carriers, reflecting the need to support different levels of process complexity across the semiconductor manufacturing flow. For manufacturers, the value of glass carriers lies in enabling more stable, high-yield processing. By providing flatness, stability, and precision, glass carriers can help reduce warpage and handling challenges in increasingly demanding packaging environments. This makes them an important enabling material for the production side of advanced packaging. Glass Core Technology Targets Performance at Scale While glass carriers address the immediate manufacturability challenges of thin-wafer processing, glass core substrates point to a longer-term shift in package architecture. As AI and high-performance computing packages become larger and integrate more chiplets, HBM stacks, and high-density interconnects, conventional organic substrates can face increasing pressure from warpage, dimensional variation, and electrical limitations. Glass is therefore being evaluated not only as a temporary process support, but also as a potential structural platform for next-generation packages. The technical appeal lies in glass's dimensional stability, flatness, and ability to support finer interconnect geometries. These properties can help package designers increase interconnect density, improve layer-to-layer alignment, and build larger system-in-package structures while maintaining tighter process control. Corning's own activities show that glass has already moved beyond laboratory research in adjacent advanced-packaging processes. Its high-precision glass carriers are used for temporary bonding in wafer thinning, fan-out processing, and advanced 2.5D and 3D packaging. According to Corning, the company has shipped hundreds of thousands of carrier wafers to top-tier customers, that include foundries, HBM manufacturers, and outsourced semiconductor assembly and test providers. Corning also offers glass carriers across a range of coefficients of thermal expansion and says its advanced packaging carriers can reduce in-process warpage by as much as 40%. Carrier applications are distinct from permanent glass core substrates. The combination of production-oriented carrier deployments provides practical evidence of the industry's broader direction. As packages become larger and more tightly integrated, glass is emerging as a materials platform that could support both near-term process stability and longer-term opportunites in package density, electrical performance, and scalability. "What we're seeing across the ecosystem is growing recognition that advanced packaging challenges cannot be solved through design alone," said Eric Chiang, Business Development Director, Packaging & Wafers, Corning Incorporated. "Materials innovation is becoming an increasingly important contributor to overall package performance and manufacturability." Corning Brings Glass Expertise to Advanced Packaging Corning's role in semiconductor packaging builds on decades of display glass leadership and a 175-year legacy in materials science. Capabilities in precision glass formulation, ultra-flat surfaces, dimensional stability, surface quality, tight process control, and high-volume manufacturing are increasingly relevant as advanced packages become larger, thinner, and more complex. Glass carriers and glass core technology give Corning two complementary paths into this market. Carriers support thin-wafer handling, warpage control, process stability, and yield. Glass core technology is being explored to address longer-term needs for larger package formats, finer interconnects, and improved electrical performance. Through close collaboration with semiconductor ecosystem partners and customers, Corning has developed a clear understanding of how advanced packaging is evolving. The company is applying that insight, together with its glass science and manufacturing expertise, to develop materials solutions that support the industry's next generation of packaging performance and manufacturability.